Study on Integration of Porous Low Dielectric Constant Material

碩士 === 國立交通大學 === 電子工程系 === 89 === As ULSI circuits are scaled down to deep submicrom regime, interconnect delay becomes increasingly dominant over intrinsic gate delay. To reduce the RC delay time, many low dielectric constant materials have been developed. Using low dielectric constant...

Full description

Bibliographic Details
Main Authors: Chun-Huai Li, 李純懷
Other Authors: Simon M. Sze
Format: Others
Language:en_US
Published: 2001
Online Access:http://ndltd.ncl.edu.tw/handle/35365231940520808775

Similar Items