Fabrication of 0.15 μm T-shaped Gate by Electron-beam Lithography for Compound Semiconductor High-speed Device applications

碩士 === 國立交通大學 === 材料科學與工程系 === 89 === A process for fabricating 0.15 μm T-shaped gate using electron-beam lithography has been established. Bi-layer resist system using HI/LO sensitivity resist was used to provide T-shaped resist cavity with undercut profile suitable for lift-off process....

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Bibliographic Details
Main Authors: Mencius Tseng, 曾孟修
Other Authors: Edward Y. Chang
Format: Others
Language:en_US
Published: 2001
Online Access:http://ndltd.ncl.edu.tw/handle/96368314641475504536