The Study of Alternative Interconnect Technology for GaAs MMICs
碩士 === 國立交通大學 === 材料科學與工程系 === 89 === In this study, the low k material Benzocyclobutene (BCB) is used as the inter-metal dielectric, and Cu is used as the conducting metal to form the alternative interconnect technology for GaAs MMICs. Technologies of these processes are described in det...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2001
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| Online Access: | http://ndltd.ncl.edu.tw/handle/39399427280109865910 |