Probabilistic Failure Modes Characterization for Viscoelastoplastic IC Packages
碩士 === 國立成功大學 === 機械工程學系 === 89 === ABSTRACT The increase in circuit density and decrease in volume size in IC packages have emerged as an inevitable trend in recent years. As a result, the reliability of IC packages becomes very stern. The study of impact factors such as the p...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2001
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| Online Access: | http://ndltd.ncl.edu.tw/handle/65897574055713971448 |