電漿輔助化學氣相沉積二氧化矽薄膜之內應力分析

碩士 === 國立成功大學 === 機械工程學系 === 89 === Plasma enhanced chemical vapor deposition (PECVD) is an important thin film process for the fabrication of microelectronic devices and microelectromechanical systems (MEMS). Because PECVD is facilitated by plasma rather than by high temperature, it is widely used...

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Bibliographic Details
Main Author: 林士淵
Other Authors: 陳國聲
Format: Others
Language:zh-TW
Published: 2001
Online Access:http://ndltd.ncl.edu.tw/handle/96357105447165492883