Investigations on Applying Electroless Ni-Cu-P Alloy as the Under Bump Metallurgy of Flip Chip Solder Bump
博士 === 國立成功大學 === 材料科學及工程學系 === 89 === The interfacial reaction between under bump metallurgy (UBM) and solder alloy significantly affects the material properties of the solder bump. Hence it is necessary to control the interfacial reaction on both material and process aspects. Electroless Ni-Cu-P...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2001
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| Online Access: | http://ndltd.ncl.edu.tw/handle/28380484952999116707 |