To Develop the Method to Identify the Surface Defects on the Substrutes for IC Package
碩士 === 華梵大學 === 機電工程研究所 === 89 === Abstract The IC packaging substrates such as lead-frames and BGA are required to pass very rigorous quality assurance. Although most of the imperfection of the substrates can be detected and winnowed by using the automatic vision inspection machine, but...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2001
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| Online Access: | http://ndltd.ncl.edu.tw/handle/94886461899243361379 |