A study of flat superfinishing silicon wafer

碩士 === 華梵大學 === 機電工程研究所 === 89 === The purpose of this paper is to investigate the influence of the diamond grain size, the spindle speed, the workpiece speed, and the operating pressure of the vertical flat superfinishing silicon wafer on the roughness, total thickness variation and resistance rate...

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Bibliographic Details
Main Authors: Ko-Chang Chen, 陳谷全
Other Authors: Shenq-Yih Luo
Format: Others
Language:zh-TW
Published: 2001
Online Access:http://ndltd.ncl.edu.tw/handle/06330614765595418903