Study on the Contact Resistance and Reliability for Semiconductor Metallization

碩士 === 逢甲大學 === 電子工程學系 === 89 === Two issues,〝Part I. Investigation of heat-treated ohmic contacts on p-GaN〞and〝Part II. Reliability of copper interconnects〞, were investigated and discussed in this thesis. Part I. Investigation of heat-treated ohmic contacts on p-GaN...

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Bibliographic Details
Main Authors: Koung Yang Laio, 廖光陽
Other Authors: D- G. Liu
Format: Others
Language:en_US
Published: 2001
Online Access:http://ndltd.ncl.edu.tw/handle/87290428990140482612