A Study of Defect Inspection and Analysis of Printed Circuit Board Processes

碩士 === 中原大學 === 工業工程研究所 === 89 === This research studies defect inspection and analysis of printed circuit board processes by exploring the relationship and characteristics between defects, background, and circuit. This work can be divided into defect recognition and processes defect analysis two po...

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Bibliographic Details
Main Authors: Ting-Yi Wang, 王定一
Other Authors: Timon Chih-Ting. Du
Format: Others
Language:zh-TW
Published: 2001
Online Access:http://ndltd.ncl.edu.tw/handle/97323844450780165440