Moisture-Induced Deformations and Stresses in Plastic IC Packages
碩士 === 長庚大學 === 機械工程研究所 === 89 === The characteristics of moisture absorption and desorption of plastic molding compound has been a serious factor of influencing the deformations and stresses, as well as reliability of electronic packages. In case of moisture entering the package component during th...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2001
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| Online Access: | http://ndltd.ncl.edu.tw/handle/63655368776646599917 |