Multifunctional Calibration Fixture for Piezoresistive Stress Sensors above room Temperature
碩士 === 國防大學中正理工學院 === 兵器系統工程研究所 === 89 === Recently, IC (Integrated Circuit) chips that are made by modern semiconductor process go to higher density, lower weight, lower thickness and smaller in size. In the same time, thermal stress in electronic packaging due to CTE (Thermal Expansion...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2001
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| Online Access: | http://ndltd.ncl.edu.tw/handle/50373142930386851500 |