| Summary: | 碩士 === 元智大學 === 機械工程研究所 === 88 === Most of domestic die/mold manufacturers use manual polishing during the final part of die production. It lowers their productivity and also increase production cost .To overcome the above mentioned difficulties, the main objective of this thesis is to perform a fundamental research on ElectroChemical Mechanical Polishing (ECMP) which is a combination of the principle of ElectroChemical Machining (ECM) process and mechanical Polishing (MP). To understand the inner mechanism of ECMP process and the prominent effects of process parameters on the quality and efficiency of die polishing.
Fundamental electrochemestry analysis and polishing experiments were conducted on SKD11, SKD61, S45C and SUS304, the most used die steel materials. From the static experiments (fundamental electrochemistry analysis). We study the conditions under which the membrane of passivation may occur. From the dynamic experiments (polishing experiment), we studies the efficiency of the ECMP process on polishing. It has been demonstrated the efficiency was improved by as much as 2/3. Taguchi method was employed to conducts experimental design to evaluate the effect of process parameters on the efficiency of the process, roughness of the workpiece, attrition of the polishing head. The results show good potential of the ECMP on die/mold polishing.
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