The Process Layer Oriented Design of Facility Layout and Material Handling System for the Modularized Wafer Fabrication Factories

碩士 === 國立臺灣大學 === 機械工程學研究所 === 88 === Due to the reentry appearance of semiconductor manufacturing process, the problem of material handling becomes more complex in recent facility layout. It will cause the long cycle time, high WIP level, unstable throughput, thus decreases the competition of produ...

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Bibliographic Details
Main Authors: Chen, Hung-Wei, 陳宏偉
Other Authors: Hsieh, Shu-Hua
Format: Others
Language:zh-TW
Published: 2000
Online Access:http://ndltd.ncl.edu.tw/handle/88244448558443200735