覆晶構裝改變凸塊形狀、大小及排列對強度及翹曲的影響
碩士 === 國立臺灣大學 === 機械工程學研究所 === 88 === The bump sizes are usually uniform in flip chip package. However, the bump in the corners of the chip might sustain greater stress. This research attempts to optimize the package for robust performance. Two approaches are proposed here: to place larger bumps on...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2000
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| Online Access: | http://ndltd.ncl.edu.tw/handle/46882067955358719531 |