A Study of Stress Behavior of Copper FilmsPrepared by Sputter and CVD Process in Cu/Diffusion Barrier/Si Three Layers Structer

A Study of Stress Behavior of Copper FilmsPrepared by Sputter and CVD Process in Cu/Diffusion Barrier/Si Three Layers Structer

碩士 === 國立清華大學 === 材料科學工程學系 === 88 ===

Bibliographic Details
Main Authors:	Tsung-Cheng Lin, 林宗正
Other Authors:	Jwo-Huei Jou
Format:	Others
Language:	zh-TW
Published:	2000
Online Access:	http://ndltd.ncl.edu.tw/handle/92195473176060926012

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