A Study of Stress Behavior of Copper FilmsPrepared by Sputter and CVD Process in Cu/Diffusion Barrier/Si Three Layers Structer

碩士 === 國立清華大學 === 材料科學工程學系 === 88 ===

Bibliographic Details
Main Authors: Tsung-Cheng Lin, 林宗正
Other Authors: Jwo-Huei Jou
Format: Others
Language:zh-TW
Published: 2000
Online Access:http://ndltd.ncl.edu.tw/handle/92195473176060926012