A Study of Stress Behavior of Copper FilmsPrepared by Sputter and CVD Process in Cu/Diffusion Barrier/Si Three Layers Structer
碩士 === 國立清華大學 === 材料科學工程學系 === 88 ===
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2000
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Online Access: | http://ndltd.ncl.edu.tw/handle/92195473176060926012 |
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ndltd-TW-088NTHU01590912016-07-08T04:23:16Z http://ndltd.ncl.edu.tw/handle/92195473176060926012 A Study of Stress Behavior of Copper FilmsPrepared by Sputter and CVD Process in Cu/Diffusion Barrier/Si Three Layers Structer 濺鍍銅膜與化學氣相沉積銅膜在銅膜/擴散阻礙層/矽基材三層結構中之應力行為探討 Tsung-Cheng Lin 林宗正 碩士 國立清華大學 材料科學工程學系 88 Jwo-Huei Jou 周卓煇 2000 學位論文 ; thesis 67 zh-TW |
collection |
NDLTD |
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zh-TW |
format |
Others
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description |
碩士 === 國立清華大學 === 材料科學工程學系 === 88 ===
|
author2 |
Jwo-Huei Jou |
author_facet |
Jwo-Huei Jou Tsung-Cheng Lin 林宗正 |
author |
Tsung-Cheng Lin 林宗正 |
spellingShingle |
Tsung-Cheng Lin 林宗正 A Study of Stress Behavior of Copper FilmsPrepared by Sputter and CVD Process in Cu/Diffusion Barrier/Si Three Layers Structer |
author_sort |
Tsung-Cheng Lin |
title |
A Study of Stress Behavior of Copper FilmsPrepared by Sputter and CVD Process in Cu/Diffusion Barrier/Si Three Layers Structer |
title_short |
A Study of Stress Behavior of Copper FilmsPrepared by Sputter and CVD Process in Cu/Diffusion Barrier/Si Three Layers Structer |
title_full |
A Study of Stress Behavior of Copper FilmsPrepared by Sputter and CVD Process in Cu/Diffusion Barrier/Si Three Layers Structer |
title_fullStr |
A Study of Stress Behavior of Copper FilmsPrepared by Sputter and CVD Process in Cu/Diffusion Barrier/Si Three Layers Structer |
title_full_unstemmed |
A Study of Stress Behavior of Copper FilmsPrepared by Sputter and CVD Process in Cu/Diffusion Barrier/Si Three Layers Structer |
title_sort |
study of stress behavior of copper filmsprepared by sputter and cvd process in cu/diffusion barrier/si three layers structer |
publishDate |
2000 |
url |
http://ndltd.ncl.edu.tw/handle/92195473176060926012 |
work_keys_str_mv |
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