A Study of Stress Behavior of Copper FilmsPrepared by Sputter and CVD Process in Cu/Diffusion Barrier/Si Three Layers Structer

碩士 === 國立清華大學 === 材料科學工程學系 === 88 ===

Bibliographic Details
Main Authors: Tsung-Cheng Lin, 林宗正
Other Authors: Jwo-Huei Jou
Format: Others
Language:zh-TW
Published: 2000
Online Access:http://ndltd.ncl.edu.tw/handle/92195473176060926012
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spelling ndltd-TW-088NTHU01590912016-07-08T04:23:16Z http://ndltd.ncl.edu.tw/handle/92195473176060926012 A Study of Stress Behavior of Copper FilmsPrepared by Sputter and CVD Process in Cu/Diffusion Barrier/Si Three Layers Structer 濺鍍銅膜與化學氣相沉積銅膜在銅膜/擴散阻礙層/矽基材三層結構中之應力行為探討 Tsung-Cheng Lin 林宗正 碩士 國立清華大學 材料科學工程學系 88 Jwo-Huei Jou 周卓煇 2000 學位論文 ; thesis 67 zh-TW
collection NDLTD
language zh-TW
format Others
sources NDLTD
description 碩士 === 國立清華大學 === 材料科學工程學系 === 88 ===
author2 Jwo-Huei Jou
author_facet Jwo-Huei Jou
Tsung-Cheng Lin
林宗正
author Tsung-Cheng Lin
林宗正
spellingShingle Tsung-Cheng Lin
林宗正
A Study of Stress Behavior of Copper FilmsPrepared by Sputter and CVD Process in Cu/Diffusion Barrier/Si Three Layers Structer
author_sort Tsung-Cheng Lin
title A Study of Stress Behavior of Copper FilmsPrepared by Sputter and CVD Process in Cu/Diffusion Barrier/Si Three Layers Structer
title_short A Study of Stress Behavior of Copper FilmsPrepared by Sputter and CVD Process in Cu/Diffusion Barrier/Si Three Layers Structer
title_full A Study of Stress Behavior of Copper FilmsPrepared by Sputter and CVD Process in Cu/Diffusion Barrier/Si Three Layers Structer
title_fullStr A Study of Stress Behavior of Copper FilmsPrepared by Sputter and CVD Process in Cu/Diffusion Barrier/Si Three Layers Structer
title_full_unstemmed A Study of Stress Behavior of Copper FilmsPrepared by Sputter and CVD Process in Cu/Diffusion Barrier/Si Three Layers Structer
title_sort study of stress behavior of copper filmsprepared by sputter and cvd process in cu/diffusion barrier/si three layers structer
publishDate 2000
url http://ndltd.ncl.edu.tw/handle/92195473176060926012
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