The Study of the Moisture Effect on the Warpage of IC Packages in the IR-Reflow Process
碩士 === 國立中山大學 === 機械工程學系研究所 === 88 === Abstract： The main aim of this paper is to utilizing the Shadow Moirè method to study the moisture effect on the warpage of PBGA IC package under the IR-reflow process. An environmental controlled box is designed and built. Three combinations of different moist...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2000
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| Online Access: | http://ndltd.ncl.edu.tw/handle/67751684491320976619 |