The Matrix Compaction Thermal Models of PC Boards
碩士 === 國立交通大學 === 電機與控制工程系 === 88 === Because the design of electronic circuit is developed rapidly, the conventional thermal simulation techniques will take a lot of computation memory and time. Thus this thesis presents a compaction electro-thermal modeling technique by matrix compaction. This tec...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2000
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| Online Access: | http://ndltd.ncl.edu.tw/handle/18153709649846771615 |