The Electrical Analysis of the Conductors on an IC Package Substrate
碩士 === 國立交通大學 === 電機與控制工程系 === 88 === As the semiconductor techniques have progressed rapidly, the IC packaging tech-niques are also improved simultaneously. Small-and-light IC packages and strong-and-fast functions are always the design and fabrication goals. Therefore, the required I/O pin numbe...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2000
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| Online Access: | http://ndltd.ncl.edu.tw/handle/66713514258688333572 |