Surface Reaction of Pentakis(ethylmethylamido) tantalum

碩士 === 國立交通大學 === 應用化學系 === 88 === Tantalum nitride is one of viable candidates for copper diffusion barrier materials in copper-based interconnect technology. We have studied the surface reaction of pentakis(ethylmethyl amido) tantalum on Cu(111) surface within an UHV chambe...

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Bibliographic Details
Main Authors: jelin, 王智麟
Other Authors: Hsin-Tien Chiu
Format: Others
Language:zh-TW
Published: 2000
Online Access:http://ndltd.ncl.edu.tw/handle/42228618235181486205