Thermal Stress Analysis of Electronic Packages
碩士 === 國立交通大學 === 機械工程系 === 88 === The aim of this study is to investigate the failure behavior induced by thermal cyclic loading of the Thermal -Enhanced PBGA. In this study, thermal stress analyses of Au wire, interfaces of different materials and solder balls are carried out by using A...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2000
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| Online Access: | http://ndltd.ncl.edu.tw/handle/83014860367136633742 |