A Study of the Regression Method on the Effect of Wafer Polishing
碩士 === 國立交通大學 === 機械工程系 === 88 === In the quarter sub-micronmeter process of the semi-conductor production. We aim to achieve the planarization of the full field severely on the exposal surface, not only the planarization of local fields. Up to this time now, only the Chemical Mechanical...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2000
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| Online Access: | http://ndltd.ncl.edu.tw/handle/51110840489541626793 |