Study on Low Dielectric Constant Diamond-Like Carbon Thin Films by Gridless Ion Beam Deposition

碩士 === 國立交通大學 === 材料科學與工程系 === 88 === For the needs of scaling down the feature sizes and increasing the circuit speed for IC manufacturing, the trend toward increasing interconnect packing density has driven the development of multilevel interconnect syst...

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Bibliographic Details
Main Authors: Hsiu-Ling Huang, 黃秀鈴
Other Authors: Chia-Fu Chen
Format: Others
Language:en_US
Published: 2000
Online Access:http://ndltd.ncl.edu.tw/handle/04713444463115703383