Technology of Electroplating Copper in Sub-0.15 um Trenches or Vias
碩士 === 國立交通大學 === 材料科學與工程系 === 88 === In ultra large integrated circuit (ULSI) technology, copper interconnect technology has been developed continuously and incorporated in commercial products. As considering the constrain of integration of copper metallization, damascene structure promises a prac...
| Main Authors: | , |
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| Format: | Others |
| Language: | en_US |
| Published: |
2000
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| Online Access: | http://ndltd.ncl.edu.tw/handle/17277223612345015316 |