| Summary: | 碩士 === 國立成功大學 === 機械工程學系 === 88 === The linkage-spring model has been used to determine the design rules to reduce the loop heights and the sagging of gold wire in the package. The purpose of this thesis is to simulate the capillary trajectory from the first bond to the second bond stages by a modified linkage-spring model including a looping speed factor. Also, the looping speed effects on the wirebond profiles due to the inertia mass and the change of material properties in different strain-rates have been studied in this thesis.
At the same time, Taguchi method was used for the robust design of wire-bonding profile for I.C. packaging. Using the Analysis of Variance finds out major factors which affects quality characteristics. The object is to find out the optimal assembly of control factors and levels. Finally, we presents forward and inverse neural network models to predict the loop profile parameters respectively. With the present methodology, how to design loop profile parameter would take a considerable amount of time. The design process can be accelerated in real time by using a neural network.
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