The Taguchi Method and Neural Network Analysis in a Loop of Wire Bonding Profile for I.C. Packaging
碩士 === 國立成功大學 === 機械工程學系 === 88 === The linkage-spring model has been used to determine the design rules to reduce the loop heights and the sagging of gold wire in the package. The purpose of this thesis is to simulate the capillary trajectory from the first bond to the second bond stages by a modif...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2000
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| Online Access: | http://ndltd.ncl.edu.tw/handle/49111436032721865159 |