Dynamic plastic deformation behaviour and microstructural characteristics of 60Sn-40Pb solder under various temperatures

碩士 === 國立成功大學 === 機械工程學系 === 88 === The purpose of this study is to investigate the dynamic plastic behavior of 60Sn-40Pb solder under various temperatures and strain rates by means of a split Hopkinson bar. Tested temperatures were obtained by enclosing the specimen in a clam shell heati...

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Bibliographic Details
Main Authors: Jyh-Yuan Jan, 詹志源
Other Authors: Woei-Shyan Lee
Format: Others
Language:zh-TW
Published: 2000
Online Access:http://ndltd.ncl.edu.tw/handle/24755595480019021580