| Summary: | 碩士 === 國立成功大學 === 機械工程學系 === 88 === In IC package, when EMC filling cavity and curing in transfer mold, adhesion occurs in interface between EMC and the surface of mold cavity. Adhesion force will cause fail of encapsulation, and unreliability of IC package products.
The object of the study is to develop adhesion test instrument and measuring technology, that is based on material test system and micro material test system. Adhesion test instrument makes interface of EMC and mold surface, in high pressure and temperature, with material test system and temperature control system. After interface forming, adhesion force will be measured by micro material test system. Taguchi method is used to design adhesion test experiment, and analysis for effects of control factors in transfer molding process.
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