Development of Test Methodology and Research on Mold Adhesion in IC Packaging
碩士 === 國立成功大學 === 機械工程學系 === 88 === In IC package, when EMC filling cavity and curing in transfer mold, adhesion occurs in interface between EMC and the surface of mold cavity. Adhesion force will cause fail of encapsulation, and unreliability of IC package products. The object of the stu...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2000
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/56787971492303590164 |