Thermal Deformation Analysis of IC Package in Molding and Reflow Processes
碩士 === 國立成功大學 === 機械工程學系 === 88 === Due to the change of temperature in packaging processes and the different expansion coefficient between package materials, the thermal stress and thermal warpage will occur .It will affect its operation and quality of electronic product. Now we analyze...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2000
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| Online Access: | http://ndltd.ncl.edu.tw/handle/12746273181609705502 |