The Influence of Different Deposition Conditions on the Growth and Properties of Electroless Ni Plating as the UBM of Solder Bump
碩士 === 國立成功大學 === 材料科學及工程學系 === 88 === The objective of this research was to determine the impact of different deposition conditions on the electroless Ni plating and its diffusion barrier properties as the UBM for solder bump. Experimentally the concentration of stabilizers, Thiourea or Lead Acetat...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2000
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| Online Access: | http://ndltd.ncl.edu.tw/handle/99763309353880457629 |