使用氮化鋁粉體提升半導體封裝材料熱傳導性質之研究
碩士 === 國立成功大學 === 化學工程學系 === 88 === Abstract Owing to the trend of faster and denser circuit design, the dielectric properties of packaging materials for semi-conductors will have greater influence on performance and reliability. Also, as chips become more densely packaged, thermal di...
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| Format: | Others |
| Language: | zh-TW |
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2000
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| Online Access: | http://ndltd.ncl.edu.tw/handle/75989214813463039905 |