Thermal Creep-rupture Analysis of Electric Packaging Component for Mini-BGA
碩士 === 國立中興大學 === 機械工程學系 === 88 === Abstract The major goal of the present study is to investigate the reliability of Mini-BGA packaging under the normal usage loading.The criteria of the packaging is determined based on the thermal creeping damages that occur between the solder ball and...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2000
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| Online Access: | http://ndltd.ncl.edu.tw/handle/23224632501216940723 |