Chipping Analysis of Dicing Silicon Wafer Process
碩士 === 華梵大學 === 機電工程研究所 === 88 === The purpose of this study was to investigate the chipping models produced in the cutting edges of dicing Si wafer using the diamond blade. The effects of dicing directions and different wafer types on the chipping size were studied. In addition, Taguchi method was...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2000
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| Online Access: | http://ndltd.ncl.edu.tw/handle/05410619266312937487 |