Application of Iterative Path Revision Technique for Laser Cutting With Controlled Fracture
碩士 === 華梵大學 === 機電工程研究所 === 88 === The laser cutting with controlled fracture technique has great potential to be applied in machining brittle material. The laser beam is focused on the surface of ceramic substrate, then the substrate will be separated controllably along the moving path of the laser...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2000
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| Online Access: | http://ndltd.ncl.edu.tw/handle/98277443784216321534 |