The Influence of Cu Interconnect with Different Diffusion Barrier after CMP Process
碩士 === 逢甲大學 === 電機工程學系 === 88 === "The main idea of the thesis is to study the copper damascene process to make the dishing effect of copper line and erosion effect of dielectric layer, moreover is to study the influence induced to the electrical characteristic of interconnects by th...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2000
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| Online Access: | http://ndltd.ncl.edu.tw/handle/09847892959340969697 |