Dynamic Analysis, Motion Control and Trajectory Planning of Wafer Transfer Robot

• Main Authors: Tsung-Yang Liu, 劉宗揚
• Other Authors: Chin-Horng Yau
• Format: Others
• Language: zh-TW
• Published: 2000
• Online Access: http://ndltd.ncl.edu.tw/handle/55710855488253102647

碩士 === 中原大學 === 機械工程學系 === 88 === The wafer transfer robot is an important part of the cluster-tools. This thesis will present the trajectory planning of the robot in the front-end module of the cluster-tools, analysis of the dynamics and simulation on the motion of the robot in the vacuum transfer chamber. In the traditional cluster-tools, the robot in front-end module has a horizontal degree of freedom and transfers wafer by extending of the three robot’s arm. This research will try to fix the robot’s base and design the appropriate trajectory that the robot will transfer wafer along it just by extending the robot arms. The universal motion curve is used in the system established by the PD-type Computed-Torque method and simulates the robot’s motion. Then computed transferring time shows more efficient than the robot used in the traditional cluster-tools. Because the vacuum requirement must be maintained in the vacuum chamber, the robot in the vacuum transfer chamber should be driven by belt transmit mechanism. The belt’s stiffness will cause some interference when the robot moves. Therefore, this thesis will analyze and establish the robot’s dynamic model that dealt with belt elastics. Moreover, a complete wafer transfer robot has several other components, which will cause some disturbance and friction that will affect the robot’s motion. As such, the dynamic models of friction module, DC servomotor and the harmonic drives module are established and analyzed. In the end, the robot system with these models will be simulated and to observe their motion situation.