Thin-film Thermocouple Fabricated by Sputtering Deposition in Application to Contacted Temperature Measurement during Ultrasonic Wire Bounding
碩士 === 國立中正大學 === 機械系 === 88 === Wire bonding, mainly responsible for electricity and signal delivery among devices, is a critical process in electronic package. Depending on the materials to be connected, the three often-used boding techniques are the thermocompression, ultrasonic, and thermosonic...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2000
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| Online Access: | http://ndltd.ncl.edu.tw/handle/88009959160687123622 |