The Study of the Premature Delamination of PI/Epoxy/Cu Interface in the Inner Layer of Flexible Circuit Board
碩士 === 元智大學 === 化學工程研究所 === 87 === The difference in compositions and degradation rates of the epoxy adhesive in the polyimide / Copper interfaces are studied with Attenuated Total Reflection Infrared Spectroscopy。From the changes in intensities of the acid and ester characteristic bands，it is shown...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
1999
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| Online Access: | http://ndltd.ncl.edu.tw/handle/51104458322323978102 |