Thermal and Warpage Analysis of IC Packages
碩士 === 國立雲林科技大學 === 機械工程技術研究所 === 87 === In this study, the thermal performance and warpage of IC packages are studied by finite element method(FEM). Both the thermally enhanced PQFP and high power dissipation PBGA are studied. The temperature distribution of both PQFP and PBGA under nominal power d...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
1999
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| Online Access: | http://ndltd.ncl.edu.tw/handle/75243117341647603561 |