STUDY OF ELECTRICAL ANALYSES FOR BGA PACKAGE
碩士 === 國立雲林科技大學 === 電子工程與資訊工程技術研究所 === 87 === Ball Grid Array (BGA) technology is becoming the packaging technology of choice. BGA packaging technology offers superior electrical, thermal, and size performance compared to other existing package technologies (e.g. QFPs, PLCCs, etc.) [3]. B...
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ndltd-TW-087YUNTE3930212015-10-13T11:50:27Z http://ndltd.ncl.edu.tw/handle/77301851666705051051 STUDY OF ELECTRICAL ANALYSES FOR BGA PACKAGE 球腳格狀陣列封裝之電性分析研究 Chih-Wei Tsai 蔡志偉 碩士 國立雲林科技大學 電子工程與資訊工程技術研究所 87 Ball Grid Array (BGA) technology is becoming the packaging technology of choice. BGA packaging technology offers superior electrical, thermal, and size performance compared to other existing package technologies (e.g. QFPs, PLCCs, etc.) [3]. Because the parasitic effects associated with IC packaging can degrade the performance of the semiconductor device as operation speed and density of CMOS Ics become higher, we must analyze and suppress the dominant electrical noises including cross-talk and switching noise prior to the selection of the package or assembly of the final devices[4] . The objective of this thesis was to investigate the dominant electrical noises of 328PBGA for high speed applications. To survey the electrical performance in IC packaging, we must first accurately estimate the electrical parameters (e.g. R、L、C matrices) [25], and then calculate the generated noise by these matrices. By handling the arrangements of signal and P/G lines in electronic packaging, we can get the better electrical performance [6]. In this thesis, various arrangements of conductors causing different noises in TSOP packages will also be manifested. To investigate the cross-talk, three different structures frequently used in PCB are compared. All of the simulation results were produced by using ANSOFT Maxwell and HSPICE simulator. Yang-Hua Chang 張 彥 華 1999 學位論文 ; thesis 84 zh-TW |
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碩士 === 國立雲林科技大學 === 電子工程與資訊工程技術研究所 === 87 === Ball Grid Array (BGA) technology is becoming the packaging technology of choice. BGA packaging technology offers superior electrical, thermal, and size performance compared to other existing package technologies (e.g. QFPs, PLCCs, etc.) [3].
Because the parasitic effects associated with IC packaging can degrade the performance of the semiconductor device as operation speed and density of CMOS Ics become higher, we must analyze and suppress the dominant electrical noises including cross-talk and switching noise prior to the selection of the package or assembly of the final devices[4] .
The objective of this thesis was to investigate the dominant electrical noises of 328PBGA for high speed applications. To survey the electrical performance in IC packaging, we must first accurately estimate the electrical parameters (e.g. R、L、C matrices) [25], and then calculate the generated noise by these matrices. By handling the arrangements of signal and P/G lines in electronic packaging, we can get the better electrical performance [6]. In this thesis, various arrangements of conductors causing different noises in TSOP packages will also be manifested. To investigate the cross-talk, three different structures frequently used in PCB are compared. All of the simulation results were produced by using ANSOFT Maxwell and HSPICE simulator.
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Yang-Hua Chang |
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Yang-Hua Chang Chih-Wei Tsai 蔡志偉 |
author |
Chih-Wei Tsai 蔡志偉 |
spellingShingle |
Chih-Wei Tsai 蔡志偉 STUDY OF ELECTRICAL ANALYSES FOR BGA PACKAGE |
author_sort |
Chih-Wei Tsai |
title |
STUDY OF ELECTRICAL ANALYSES FOR BGA PACKAGE |
title_short |
STUDY OF ELECTRICAL ANALYSES FOR BGA PACKAGE |
title_full |
STUDY OF ELECTRICAL ANALYSES FOR BGA PACKAGE |
title_fullStr |
STUDY OF ELECTRICAL ANALYSES FOR BGA PACKAGE |
title_full_unstemmed |
STUDY OF ELECTRICAL ANALYSES FOR BGA PACKAGE |
title_sort |
study of electrical analyses for bga package |
publishDate |
1999 |
url |
http://ndltd.ncl.edu.tw/handle/77301851666705051051 |
work_keys_str_mv |
AT chihweitsai studyofelectricalanalysesforbgapackage AT càizhìwěi studyofelectricalanalysesforbgapackage AT chihweitsai qiújiǎogézhuàngzhènlièfēngzhuāngzhīdiànxìngfēnxīyánjiū AT càizhìwěi qiújiǎogézhuàngzhènlièfēngzhuāngzhīdiànxìngfēnxīyánjiū |
_version_ |
1716848757118599168 |