STUDY OF ELECTRICAL ANALYSES FOR BGA PACKAGE
碩士 === 國立雲林科技大學 === 電子工程與資訊工程技術研究所 === 87 === Ball Grid Array (BGA) technology is becoming the packaging technology of choice. BGA packaging technology offers superior electrical, thermal, and size performance compared to other existing package technologies (e.g. QFPs, PLCCs, etc.) [3]. B...
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| Format: | Others |
| Language: | zh-TW |
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1999
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| Online Access: | http://ndltd.ncl.edu.tw/handle/77301851666705051051 |