Thermal Analysis of Heat Sink with Sloped Plate Fins in Personal Computer

• Main Authors: Yah-Dean Tsay, 蔡亞典
• Other Authors: Ji-Jen Lee
• Format: Others
• Language: zh-TW
• Published: 1999
• Online Access: http://ndltd.ncl.edu.tw/handle/71385107892048445281

碩士 === 大同工學院 === 機械工程研究所 === 87 === Among all the modern high-tech products, the electronic devices are more and more prevailing. Therefore, how to remove the heat generated during its operation to make sure of the stability of the product is becoming a very important issue of the recent researches. The most commonly used method for electronic cooling is to add one set of heat sink assembly on the heating component. However, different shapes and configurations of the heat sink can make their performance in heat emission very different. In the present study, both of numerical method by using Phoenics software package and experimental measurement are adopted to analyze the cooling effect under different shapes of heat sink (rectangle and trapezoid). By using the same style of sink, the effect of humidity is also explored. The results show that the best heat removing effect can be expected from that vertical fins protruding upwards from a vertical rectangular base. And under forced convection, to drill proper holes in the bottom can promote the heat removing effect. Therefore, in the future design of the heat sink assembly, we may make improvement from changing the flow path of the bottom fan and the style of the heat sink.