Thermal Analysis of Heat Sink with Sloped Plate Fins in Personal Computer

碩士 === 大同工學院 === 機械工程研究所 === 87 === Among all the modern high-tech products, the electronic devices are more and more prevailing. Therefore, how to remove the heat generated during its operation to make sure of the stability of the product is becoming a very important issue of the recent researches....

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Bibliographic Details
Main Authors: Yah-Dean Tsay, 蔡亞典
Other Authors: Ji-Jen Lee
Format: Others
Language:zh-TW
Published: 1999
Online Access:http://ndltd.ncl.edu.tw/handle/71385107892048445281