Research for electroless copper plating on POM
碩士 === 淡江大學 === 機械工程學系 === 87 === This research aims to improve the platability and adhesive strength of electroless plating copper on POM by modifying the surface morphology using sulfuric acid or hydrogen chloride solution and various conditions. It is found: High...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
1999
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| Online Access: | http://ndltd.ncl.edu.tw/handle/26099699012480466603 |