Study of IMP Ta and TaNx as diffusion barrier layer in copper metallization

Study of IMP Ta and TaNx as diffusion barrier layer in copper metallization

碩士 === 國立清華大學 === 工程與系統科學系 === 87 ===

Bibliographic Details
Main Authors:	Graham Chuang, 莊景誠
Other Authors:	F. R. Chen
Format:	Others
Language:	zh-TW
Published:	1999
Online Access:	http://ndltd.ncl.edu.tw/handle/70818139231678547980

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