A Study of The Phases in The Interface of The Pb-Sn Solder and Ni-Fe Alloy

碩士 === 國立清華大學 === 材料科學工程學系 === 87 === ABSTRACT The morphology and the development of the intermetallic phases at the Sn-Pb/Alloy 42 interface with different Pb content were studied in this work. By a new technique of pulling by epoxy resin after taper grinding, the interf...

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Bibliographic Details
Main Authors: Wei-xuan Yu, 余韋萱
Other Authors: 張士欽
Format: Others
Language:en_US
Published: 1999
Online Access:http://ndltd.ncl.edu.tw/handle/61496273787969984443