Warpage Analysis of The IC Package - PQFP

• Main Authors: Tsen Shin Li, 曾世霖
• Other Authors: Chien Chi Hui
• Format: Others
• Language: zh-TW
• Published: 1999
• Online Access: http://ndltd.ncl.edu.tw/handle/43922645080884092521

碩士 === 國立中山大學 === 機械工程學系 === 87 === A study has been performed to determine the equation of a 100 leads PQFP package warpage interrelated to material properties. Taguchi method and three-dimensional finite element methods are used to find the most influencing factors which can cause package warpage. The simulation of the UTSOP package is used to varify the validity of the proposed finite element model . Then , it can be seen from the simulative result of the 80 leads PQFP package that the effects caused by the die attach stracture can ve ignored . Finally , by comparing the signal - to - noise ratio and mean for each run of the orthogonal array proposed by the Taguchi method , the most three influencing material factors can be defermined , which are molding compound CTE (a1)、glass temperature (Tg)、Young''s modulus (E). Also , a dimensionless equation corresponding to the warpage and the three material factors is proposed . It can be seen that the proposed equation can predict the warpage quite accurate .